Dominique — Engineer I

Design safe, cost effective, and reliable distribution facilities for residential, area lighting, basic facilities and/or simple maintenance projects.

Served as a project manager to design new and modify existing nuclear plant electrical subsystems. Oversaw $25B project, responsible for projection management problem solving; liaison between client, vendors, and design team coordination to maintain project budgets; reviewed plans, specifications, technical details, acted as liaison between oversight engineers and corporate accounts, and also trained with experts in the field.

Assisted in planning, design development, contracting, bidding, construction phase and completion of capital projects totaling $300M. Responsible for the reviewed plan specifications, coordinates with trades managers and supervisors on projects scheduled construction process; reviewed related documents, checks with OSHA and environmental requirements, and tracked project schedule and executes FAMIS work orders.

May 2010 - May 2011 Prepared Aluminum Nitride LED samples for Transmission Electron Microscopy through the polishing process; operated PLC, Allen Bradley type, to create LED ingots from scratch; measured wafer sample thickness using X-Ray Diffraction; established statistical confidence by identifying sample size and acceptable error; determined levels of confidence; provided statistical information for quality improvement by identifying testing methods and samples; reverse engineered and cleaned closed loop system between manufacturing product, and measured roughness of wafer samples using Atomic Force Microscopy

Prepared Aluminum Nitride LED samples for Transmission Electron Microscopy through the polishing process; operated PLC, Allen Bradley type, to create LED ingots from scratch; measured wafer sample thickness using X-Ray Diffraction; established statistical confidence by identifying sample size and acceptable error; determined levels of confidence; provided statistical information for quality improvement by identifying testing methods and samples; reverse engineered and cleaned closed loop system between manufacturing product, and measured roughness of wafer samples using Atomic Force Microscopy.