Scott — Senior Mechanical Engineer

10 years of project experience as lead engineer performing finite element analysis using ANSYS APDL for applied thermal transient, thermal shock, static and dynamic loadings. Successfully used analyses results for increasing system fatigue life and operability for power plant components. Lead engineer for operability of High Pressure High Temperature Components Using ASME Non-LinearStrain-Based Fatigue Analysis Developed finite element model using solid elements (>2 million DOFs). Performed full plastic cyclic shakedown analysis using true stress-strain material curve. Total strain (elastic plus plastic) time histories post-processed and successfully extended operability life from 40 to 60 years for all assembly components. As technical project managerledhundreds ofLinear Elastic and Elastic-Plastic Thermo-Mechanical Stress analysis of nuclear components using ANSYS/Mechanical for structural and thermal transient loads. Mentored new ANSYS users in modeling and analysis methodologies. Owned and developed concept to functional unit, five unique Thermal and Structural qualifications of entire Emergency Core Cooling System Sump Strainers ($5 Million Cost) for operating to emergency loads for a Chinese nuclear utility. Key skills involved in program execution were ground-up assembly outline, design consultation, technical drawing development in SolidWorks as per GD&T standards, engineering analysis and 24/7 support of installation team in China for nonconformance issues. Developed strong understanding of custom shearing, rolling, forming, laser cutting of SS/CS and high-quality MIG/TIG structural welding. Performed multiple ASME elastic-plastic limit load analyses with yield to failure to compute stress margin at riveted joints between power plant pipe members and other power plant components. Experienced in performing linear-elastic fracture mechanics (LEFM) and elastic-plastic fracture mechanics (EPFM) analyses. Recognized industry expert in acoustic load driven steam dryer dynamic stress analyses. Hired to consult for both General Electric and Westinghouse steam dryer groups. Responsible for responses to NRC RAI submittals. Supported numerous litigation activities as subject expert and expert third party reviewer of analyses. Excellent written and verbal communication skills; authored several reports for assessment of the robustness of the solution to meet the requirements of the operation; ability to interact with management, team members and external vendors. As the lead ANSYS analyst, I conducted projects in solar, hydro, biomedical and aerospace due to my prior experience and ability to deliver projects in a timely and professional manner.

The sole mechanical engineer,who developed, analyzed and tested new contact designs from theoretical concept to physical prototype.Designs created in AutoCAD, analyzed in ANSYS and tested using an Instroncalibrated to measure force versus deflection and cycles to failure. Developedand calibratedan ANSYS finite element model capable of predicting thenon-linear forming operation of the contactand matchthe operational range of new contact designs. Post development of predictive ANSYS finite element model and collaboration with both process and manufacturing resulted in doubling theexisting working range of the contact design while reducing and tuning excessive contact forces.

U.S. west coast ANSYS distributor with key duties including consulting, providing ANSYS technical support, conducting ANSYS training classes, creating and conducting onsite client specific sales demos. Conducted dozens of consulting projects in industriesincluding but not limited to aerospace, biomedical, defense, disk drive, nuclear, semiconductor packaging, semiconductor manufacturing, consumer electronics and solar photovoltaic. Experience using SMA material model for nitinol stent analyses and other implantable devices. Extensive multiphyicscharacterization and yield optimization for semiconductor packagingincludingflip-chip and BGA assemblies. Experience in both leaded and lead-free Darveauxsolder joint life prediction methodologies. Stress, thermal, CFD and vibration analysis for semiconductor manufacturing equipment. Joint Strike Fighter underwing mounted ordnance shock analysis of circuit board failures.